Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
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Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
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25بك المحتوى هنا ينقصه الاستشه ...... ور وملفات عن: شبكة كرات مصفوفة
@ar
A ball grid array (BGA) is a t ...... suitable for socket mounting.
@en
BGA (ang. Ball Grid Array) obu ...... rmę szpilek, czyli tzw. pinów.
@pl
BGA (англ. Ball grid array — м ...... оляет шарикам деформироваться.
@ru
Ball Grid Array (BGA) é um tip ...... onde o "E" vem de "Enhanced".
@pt
Ball Grid Array (BGA, engl.) z ...... k und gutes Werkzeug vonnöten.
@de
La matrice de billes (en angla ...... soudé sur un circuit imprimé.
@fr
La matriz de rejilla de bolas ...... a conductividad de los mismos.
@es
球柵陣列封裝（英語：BGA、Ball Grid Array， ...... 序的工廠設備來完成的。BGA封裝裝置並不適用於插槽固定方式。
@zh
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25بك المحتوى هنا ينقصه الاستشه ...... ى تثبيت هذه الوحدة على اللوحة.
@ar
A ball grid array (BGA) is a t ...... er performance at high speeds.
@en
BGA (ang. Ball Grid Array) obu ...... zwyczaj z użyciem nagrzewnicy.
@pl
BGA (англ. Ball grid array — м ...... оляет шарикам деформироваться.
@ru
Ball Grid Array (BGA) é um tip ...... o, a colocação de novas esfera
@pt
Ball Grid Array (BGA, engl.) z ...... taktpads auf der Leiterplatte.
@de
La matrice de billes (en angla ...... soudé sur un circuit imprimé.
@fr
La matriz de rejilla de bolas ...... a conductividad de los mismos.
@es
球柵陣列封裝（英語：BGA、Ball Grid Array， ...... 序的工廠設備來完成的。BGA封裝裝置並不適用於插槽固定方式。
@zh
label
BGA
@pt
BGA
@ru
Ball Grid Array
@de
Ball Grid Array
@es
Ball Grid Array
@pl
Ball grid array
@en
Matrice de billes
@fr
شبكة كرات مصفوفة
@ar
球柵陣列封裝
@zh
