In printed circuit boards, a teardrops are typically drop-shaped features at the junction of vias or contact pads and traces. The main purpose of teardrops is to enhance structural integrity in presence of thermal or mechanical stresses. Structural integrity may be compromised, e.g., by misaligment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper.