Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are wired, bonded directly to a printed circuit board, and covered by a blob of epoxy. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. In some cases, COB construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads.