Copper interconnects
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997.
45 nm process65 nm processAlpha 21264Alpha 21364Alpha 21464Aluminum interconnectsAthlonAtomic layer depositionBack end of lineCarbon nanotubeChemical-mechanical polishingCopper-based chipsCopper chipCopper interconnectCopper silicideCu interconnectCu interconnectsDiffusion barrierElectromigrationFluorosilicate glassGameCubeHAL SPARC64IBM POWER microprocessorsIBM airgapIntegrated circuitInterconnect (integrated circuits)Multigate deviceNEC SX-6Nanoimprint lithographyPA-8000POWER3POWER5Pentium 4Pentium IIIPotential applications of carbon nanotubesPowerPC 7xxPowerPC G4Power Macintosh G3Quilt packagingR10000
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Copper interconnects
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997.
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Der Damascene-Prozess ist, wie ...... Vertiefungen eingebracht wird.
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In semiconductor technology, c ...... ntially damaging copper atoms.
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銅ベースチップとは、配線工程のメタル層において、配線として銅 ...... アメタル層の導入などを含む製造技術の大きな発展を必要とした。
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Der Damascene-Prozess ist, wie ...... Vertiefungen eingebracht wird.
@de
In semiconductor technology, c ...... stance from Motorola, in 1997.
@en
銅ベースチップとは、配線工程のメタル層において、配線として銅 ...... アメタル層の導入などを含む製造技術の大きな発展を必要とした。
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Copper interconnects
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Damascene-Prozess
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銅配線
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