Electroless nickel immersion gold
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of over the nickel, a process known by the acronym ENEPIG.
Che AuChe Ni/AuChe Ni/Au after solder maskChe Ni/Au before solder maskChe Ni/Au overallChe Ni/Au selectiveChem AuChem Ni/AuChemical AUChemical AuChemical Ni/AuChemical Ni/Au after solder maskChemical Ni/Au before solder maskChemical Ni/Au overallChemical Ni/Au selectiveChemical goldChemical nickel goldENEPIGENIGENIG after solder maskENIG before solder maskENi/IAuElectroless Nickel/Immersion GoldElectroless Nickel Immersion GoldElectroless nickel/immersion goldElectroless nickel electroless palladium immersion goldElectroless nickel with immersion goldEnigIAuImmersion AuImmersion GoldImmersion goldImmersion gold (PCB manufacturing)Immersion gold (surface finish)Immersion gold platingOverall Che Ni/AuOverall Chemical Ni/AuOverall ENIGOverall chemical Ni/AuSENIG
Wikipage redirect
Che AuChe Ni/AuChe Ni/Au after solder maskChe Ni/Au before solder maskChe Ni/Au overallChe Ni/Au selectiveChem AuChem Ni/AuChemical AUChemical AuChemical Ni/AuChemical Ni/Au after solder maskChemical Ni/Au before solder maskChemical Ni/Au overallChemical Ni/Au selectiveChemical goldChemical nickel goldDye-and-pryENEPIGENIGENIG after solder maskENIG before solder maskENi/IAuElectroless Nickel/Immersion GoldElectroless Nickel Immersion GoldElectroless copper platingElectroless nickel-phosphorus platingElectroless nickel/immersion goldElectroless nickel electroless palladium immersion goldElectroless nickel with immersion goldElectroless platingElectroplatingEnigHot air solder levelingIAU (disambiguation)IAuImmersion AuImmersion GoldImmersion goldImmersion gold (PCB manufacturing)
Link from a Wikipage to another Wikipage
primaryTopic
Electroless nickel immersion gold
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of over the nickel, a process known by the acronym ENEPIG.
has abstract
Electroless nickel immersion g ...... is needed to cover only the .
@en
化学镍金(缩写为ENIG,英語:Electroless ni ...... 95中涵盖与"黑垫"中空区域有关的内容,如表面龟裂和镍突刺。
@zh
Wikipage page ID
16,108,496
page length (characters) of wiki page
Wikipage revision ID
1,021,354,363
Link from a Wikipage to another Wikipage
wikiPageUsesTemplate
hypernym
type
comment
Electroless nickel immersion g ...... s known by the acronym ENEPIG.
@en
化学镍金(缩写为ENIG,英語:Electroless ni ...... 入焊接步骤。金厚度需要满足某些特定的公差,以确保镍的可焊性。
@zh
label
Electroless nickel immersion gold
@en
化学镍金
@zh