Embedded wafer level ball grid array
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect routing.
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Embedded wafer level ball grid array
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect routing.
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Embedded Wafer Level Ball Grid ...... stellten Wafer erzeugt werden.
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Embedded wafer level ball grid ...... et mid of 2009 (mobile phone).
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Embedded Wafer Level Ball Grid ...... stellten Wafer erzeugt werden.
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Embedded wafer level ball grid ...... pace for interconnect routing.
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Embedded Wafer Level Ball Grid Array
@de
Embedded wafer level ball grid array
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