Flip chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to com
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Flip chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to com
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Dans le domaine des semi-condu ...... des micro et nanotechnologies
@fr
Flip chip (монтаж методом пере ...... ерхности кристалла микросхемы.
@ru
Flip chip es una tecnología de ...... riado de manera más eficiente.
@es
Flip chip, also known as contr ...... ip pads to external circuitry.
@en
Flip xip és una tecnologia d'e ...... fredat de manera més eficient.
@ca
Med flip chip-teknologin monte ...... då chipet tar upp mindre yta.
@sv
覆晶技術（英語：Flip Chip），也稱“倒晶封裝”或“倒 ...... 與12吋晶圓探針測試、凸塊增長、組裝、至最終測試的完整服務。
@zh
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Dans le domaine des semi-condu ...... fil).
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@fr
Flip chip (монтаж методом пере ...... ерхности кристалла микросхемы.
@ru
Flip chip es una tecnología de ...... e chips tridimensionales (3D).
@es
Flip chip, also known as contr ...... the solder is reflowed to com
@en
Flip xip és una tecnologia d'e ...... inutes connexions elèctriques.
@ca
Med flip chip-teknologin monte ...... ering den högsta packningstäth
@sv
覆晶技術（英語：Flip Chip），也稱“倒晶封裝”或“倒 ...... 與12吋晶圓探針測試、凸塊增長、組裝、至最終測試的完整服務。
@zh
label
Flip chip
@en
Flip chip
@es
Flip chip
@ru
Flip chip
@sv
Flip xip
@ca
Flip-Chip-Montage
@de
Puce retournée
@fr
覆晶技術
@zh