Low pressure molding
Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.
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Low pressure molding
Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.
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Das Low Pressure Molding (engl ...... bei ca. 10–60 Sekunden liegt.
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Low Pressure Molding (LPM) wit ...... chemical reaction takes place.
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Das Low Pressure Molding (engl ...... turbereich von −50 bis 150 °C.
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Low Pressure Molding (LPM) wit ...... g grommets and strain reliefs.
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Low Pressure Molding
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Low pressure molding
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