Multi-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow to share mask and microelectronics wafer fabrication cost between several designs or projects. With MPC arrangement one chip is a combination of several designs and this combined chip is then repeated all over the wafer during the manufacturing. MPC arrangement produces typically roughly equal number of chip designs per wafer. MPC/MPW arrangements have also been applied for microelectromechanical systems (MEMS), integrated photonics like silicon photonics fabrication and microfluidics.