Surface activated bonding
Surface activated bonding (SAB) is a low temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High strength bonding of semiconductor, metal, and dielectric can be obtained even at room temperature.
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Surface activated bonding
Surface activated bonding (SAB) is a low temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High strength bonding of semiconductor, metal, and dielectric can be obtained even at room temperature.
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Surface activated bonding (SAB ...... ined even at room temperature.
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Surface activated bonding (SAB ...... ined even at room temperature.
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Surface activated bonding
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