Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions - Wikidata - awgldk - TriplyDB

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

http://www.wikidata.org/entity/Q28080946

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Phase diagram and structural evolution of tin/indium (Sn/In) nanosolder particles: from a non-equilibrium state to an equilibrium state.Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

http://www.wikidata.org/entity/Q28080946

description

2015 nî lūn-bûn

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2015 թուականի Մայիսին հրատարակուած գիտական յօդուած

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2015年の論文

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2015年論文

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2015年論文

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2015年論文

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2015年論文

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2015年論文

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2015年论文

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Influence of nanoparticle addi ...... g different thermal conditions

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Science and Technology of Advanced Materials

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Influence of nanoparticle addi ...... g different thermal conditions

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Ai Ting Tan

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Ai Wen Tan

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Farazila Yusof

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P2860

Interaction of a transition metal atom with intrinsic defects in single-walled carbon nanotubes.

Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints

Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads

Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging

Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering

Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

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