Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems.
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Mechanical Fracturing of Core-Shell Undercooled Metal Particles for Heat-Free SolderingOne-dimensional nano-interconnection formation.High-intensity pulse light sintering of silver nanowire transparent films on polymer substrates: the effect of the thermal properties of substrates on the performance of silver films.Self-limited plasmonic welding of silver nanowire junctions.Encapsulated nanowires: Boosting electronic transport in carbon nanotubes
P2860
Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems.
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article científic
@ca
article scientifique
@fr
articolo scientifico
@it
artigo científico
@pt
bilimsel makale
@tr
scientific article published on June 2009
@en
vedecký článok
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vetenskaplig artikel
@sv
videnskabelig artikel
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vědecký článek
@cs
name
Joining and interconnect forma ...... noelectronics and nanosystems.
@en
Joining and interconnect forma ...... noelectronics and nanosystems.
@nl
type
label
Joining and interconnect forma ...... noelectronics and nanosystems.
@en
Joining and interconnect forma ...... noelectronics and nanosystems.
@nl
prefLabel
Joining and interconnect forma ...... noelectronics and nanosystems.
@en
Joining and interconnect forma ...... noelectronics and nanosystems.
@nl
P2093
P356
P1433
P1476
Joining and interconnect forma ...... noelectronics and nanosystems.
@en
P2093
Qingzhou Cui
Subhadeep Mukherjee
Zhiyong Gu
P304
P356
10.1002/SMLL.200801551
P577
2009-06-01T00:00:00Z