Three-dimensional integration of nanotechnologies for computing and data storage on a single chip.
about
The future of electronics based on memristive systemsObservation of Resistive Switching Behavior in Crossbar Core-Shell Ni/NiO Nanowires Memristor.Electronics: 3D integration advances computing.Skin-inspired highly stretchable and conformable matrix networks for multifunctional sensing.Process-morphology scaling relations quantify self-organization in capillary densified nanofiber arrays.Seamlessly fused digital-analogue reconfigurable computing using memristors.Phototunable Biomemory Based on Light-Mediated Charge TrapSwitchable counterion gradients around charged metallic nanoparticles enable reception of radio wavesCapacitive neural network with neuro-transistors
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P2860
Three-dimensional integration of nanotechnologies for computing and data storage on a single chip.
description
2017 nî lūn-bûn
@nan
2017年の論文
@ja
2017年学术文章
@wuu
2017年学术文章
@zh-cn
2017年学术文章
@zh-hans
2017年学术文章
@zh-my
2017年学术文章
@zh-sg
2017年學術文章
@yue
2017年學術文章
@zh
2017年學術文章
@zh-hant
name
Three-dimensional integration ...... data storage on a single chip.
@en
type
label
Three-dimensional integration ...... data storage on a single chip.
@en
prefLabel
Three-dimensional integration ...... data storage on a single chip.
@en
P2093
P356
P1433
P1476
Three-dimensional integration ...... data storage on a single chip.
@en
P2093
Gage Hills
H-S Philip Wong
Krishna Saraswat
Max M Shulaker
Rebecca S Park
Roger T Howe
Subhasish Mitra
P2888
P356
10.1038/NATURE22994
P407
P577
2017-07-01T00:00:00Z
P6179
1090350170