Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers.
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Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers.
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2011 nî lūn-bûn
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2011年の論文
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2011年論文
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2011年論文
@zh-hant
2011年論文
@zh-hk
2011年論文
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2011年論文
@zh-tw
2011年论文
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2011年论文
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2011年论文
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name
Characterization of the mechan ...... ed by boron based interlayers.
@en
type
label
Characterization of the mechan ...... ed by boron based interlayers.
@en
prefLabel
Characterization of the mechan ...... ed by boron based interlayers.
@en
P2093
P1476
Characterization of the mechan ...... ied by boron based interlayers
@en
P2093
C Eisenmenger-Sittner
E Neubauer
M Kitzmantel
Mihai Chirtoc
N Kornfeind
P Kijamnajsuk
P304
P356
10.1016/J.SURFCOAT.2011.01.039
P577
2011-03-01T00:00:00Z