Room-temperature intermediate layer bonding for microfluidic devices.
about
Irreversible, direct bonding of nanoporous polymer membranes to PDMS or glass microdevices.Convenient surface functionalization of whole-Teflon chips with polydopamine coating.A method of packaging molecule/cell-patterns in an open space into a glass microfluidic channel by combining pressure-based low/room temperature bonding and fluorosilane patterning.Wafer-scale fabrication of glass-FEP-glass microfluidic devices for lipid bilayer experiments.Biocompatible "click" wafer bonding for microfluidic devices.Parylene to silicon nitride bonding for post-integration of high pressure microfluidics to CMOS devices.
P2860
Room-temperature intermediate layer bonding for microfluidic devices.
description
2009 nî lūn-bûn
@nan
2009年の論文
@ja
2009年学术文章
@wuu
2009年学术文章
@zh
2009年学术文章
@zh-cn
2009年学术文章
@zh-hans
2009年学术文章
@zh-my
2009年学术文章
@zh-sg
2009年學術文章
@yue
2009年學術文章
@zh-hant
name
Room-temperature intermediate layer bonding for microfluidic devices.
@en
Room-temperature intermediate layer bonding for microfluidic devices.
@nl
type
label
Room-temperature intermediate layer bonding for microfluidic devices.
@en
Room-temperature intermediate layer bonding for microfluidic devices.
@nl
prefLabel
Room-temperature intermediate layer bonding for microfluidic devices.
@en
Room-temperature intermediate layer bonding for microfluidic devices.
@nl
P2093
P356
P1433
P1476
Room-temperature intermediate layer bonding for microfluidic devices.
@en
P2093
Han Zuilhof
Jacob Bart
Menglong Yang
Roald Tiggelaar
Stefan Schlautmann
P304
P356
10.1039/B914270C
P577
2009-10-12T00:00:00Z