Engineered elastomer substrates for guided assembly of complex 3D mesostructures by spatially nonuniform compressive buckling.
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Thermal Release Transfer Printing for Stretchable Conformal Bioelectronics.Assembly and Self-Assembly of Nanomembrane Materials-From 2D to 3D.Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics.Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses.Forming three-dimensional closed shapes from two-dimensional soft ribbons by controlled buckling.
P2860
Engineered elastomer substrates for guided assembly of complex 3D mesostructures by spatially nonuniform compressive buckling.
description
2016 nî lūn-bûn
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2016年の論文
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2016年学术文章
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2016年学术文章
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2016年学术文章
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name
Engineered elastomer substrate ...... nuniform compressive buckling.
@en
Engineered elastomer substrate ...... nuniform compressive buckling.
@nl
type
label
Engineered elastomer substrate ...... nuniform compressive buckling.
@en
Engineered elastomer substrate ...... nuniform compressive buckling.
@nl
prefLabel
Engineered elastomer substrate ...... nuniform compressive buckling.
@en
Engineered elastomer substrate ...... nuniform compressive buckling.
@nl
P2093
P2860
P50
P356
P1476
Engineered elastomer substrate ...... nuniform compressive buckling.
@en
P2093
Haiwen Luan
John A Rogers
Juntong Wang
Kewang Nan
Matthew Chang
Mengdi Han
P2860
P356
10.1002/ADFM.201604281
P407
P577
2016-11-02T00:00:00Z