Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
about
Recent lab-on-chip developments for novel drug discovery.Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry.Digital droplet PCR on disk.Thiol-ene-epoxy thermoset for low-temperature bonding to biofunctionalized microarray surfaces.Simple Approaches to Minimally-Instrumented, Microfluidic-Based Point-of-Care Nucleic Acid Amplification Tests.
P2860
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
description
2015 nî lūn-bûn
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2015年の論文
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2015年学术文章
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2015年学术文章
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2015年学术文章
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@zh-hans
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name
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
@en
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
@nl
type
label
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
@en
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
@nl
prefLabel
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
@en
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
@nl
P2860
P50
P356
P1433
P1476
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems
@en
P2093
C E Poulsen
P2860
P304
P356
10.1039/C5LC00174A
P577
2015-05-01T00:00:00Z