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about
P31
Q11198945-b28f903f-4e97-ffeb-0aa6-aed1cfbcd650Q18155322-955ce563-4625-9c14-6da1-af4b34f6a730Q18155326-c9a1b12c-440f-8792-f856-f67c4575cf9fQ28851124-dbf22d90-4f3d-d8ca-8420-b5c37ff812c2Q64141074-8caa4bd6-4fbb-267e-8ab4-28665521e718Q73530786-dd83a966-49fd-78c1-4793-990efdaff13aQ82786977-000763ab-4a94-76aa-76c7-2ad92c7a1e09Q92544372-4627b78c-442b-641f-12b5-d5d13db6b890Q96335632-bcb92ef4-4f00-02f3-df9b-c0c990895a5f
P279
description
Gehäuseform von Integrierten S ...... erseite des Bauelements liegen
@de
type of surface-mount packaging
@en
应用在集成电路上的一种表面黏着封装技术
@zh-hans
應用於集成電路上的一種封裝技術
@zh
球柵陣列封裝技術
@zh-hant
球柵陣列封裝技術
@zh-tw
name
BGA
@hu
BGA
@pt
BGA
@ru
BGA
@tr
BGA
@uk
Ball Grid Array
@de
Ball Grid Array
@es
Ball Grid Array
@pl
Ball Grid Array
@sv
Ball grid array
@ca
type
label
BGA
@hu
BGA
@pt
BGA
@ru
BGA
@tr
BGA
@uk
Ball Grid Array
@de
Ball Grid Array
@es
Ball Grid Array
@pl
Ball Grid Array
@sv
Ball grid array
@ca
altLabel
BGA
@de
bga
@en
prefLabel
BGA
@hu
BGA
@pt
BGA
@ru
BGA
@tr
BGA
@uk
Ball Grid Array
@de
Ball Grid Array
@es
Ball Grid Array
@pl
Ball Grid Array
@sv
Ball grid array
@ca
P6366
P646
P373
BGA integrated circuit packages