Framework flexibility and the negative thermal expansion mechanism of copper(I) oxideCu2O
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Negative thermal expansion in 2H CuScO2 originating from the cooperation of transverse thermal vibrations of Cu and O atoms.Anisotropic thermal expansion of SnSe from first-principles calculations based on Grüneisen's theory.Maximizing negative thermal expansion via rigid unit modes: a geometry-based approach.
P2860
Framework flexibility and the negative thermal expansion mechanism of copper(I) oxideCu2O
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im Juni 2014 veröffentlichter wissenschaftlicher Artikel
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wetenschappelijk artikel
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наукова стаття, опублікована в червні 2014
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name
Framework flexibility and the negative thermal expansion mechanism of copper
@nl
Framework flexibility and the negative thermal expansion mechanism of copper(I) oxideCu2O
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Framework flexibility and the negative thermal expansion mechanism of copper
@nl
Framework flexibility and the negative thermal expansion mechanism of copper(I) oxideCu2O
@en
prefLabel
Framework flexibility and the negative thermal expansion mechanism of copper
@nl
Framework flexibility and the negative thermal expansion mechanism of copper(I) oxideCu2O
@en
P2093
P2860
P1433
P1476
Framework flexibility and the negative thermal expansion mechanism of copper(I) oxideCu2O
@en
P2093
Andrew L. Goodwin
Björn Winkler
Dan J. Wilson
Leila H. N. Rimmer
Martin T. Dove
P2860
P356
10.1103/PHYSREVB.89.214115
P407
P50
P577
2014-06-26T00:00:00Z