Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
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Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
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2015 nî lūn-bûn
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2015年の論文
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2015年論文
@yue
2015年論文
@zh-hant
2015年論文
@zh-hk
2015年論文
@zh-mo
2015年論文
@zh-tw
2015年论文
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2015年论文
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2015年论文
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name
Co-Design Method and Wafer-Lev ...... ered Neural Interface Systems.
@en
Co-Design Method and Wafer-Lev ...... ered Neural Interface Systems.
@nl
type
label
Co-Design Method and Wafer-Lev ...... ered Neural Interface Systems.
@en
Co-Design Method and Wafer-Lev ...... ered Neural Interface Systems.
@nl
prefLabel
Co-Design Method and Wafer-Lev ...... ered Neural Interface Systems.
@en
Co-Design Method and Wafer-Lev ...... ered Neural Interface Systems.
@nl
P2093
P2860
P356
P1433
P1476
Co-Design Method and Wafer-Lev ...... wered Neural Interface Systems
@en
P2093
Horagodage Prabhath Jeewan
Kenji Okabe
Makoto Ishida
Shota Yamagiwa
Takeshi Kawano
P2860
P304
31821-31832
P356
10.3390/S151229885
P407
P50
P577
2015-12-16T00:00:00Z