Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.
about
Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.
description
2016 nî lūn-bûn
@nan
2016年の論文
@ja
2016年学术文章
@wuu
2016年学术文章
@zh
2016年学术文章
@zh-cn
2016年学术文章
@zh-hans
2016年学术文章
@zh-my
2016年学术文章
@zh-sg
2016年學術文章
@yue
2016年學術文章
@zh-hant
name
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@en
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@nl
type
label
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@en
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@nl
prefLabel
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@en
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@nl
P2093
P2860
P1476
Leaching of metals from large ...... ic acid and hydrogen peroxide.
@en
P2093
P2860
P2888
P304
24384-24392
P356
10.1007/S11356-016-7695-9
P407
P577
2016-09-22T00:00:00Z