Ultrasonic consolidation

The Ultrasonic Consolidation or Ultrasonic Additive Manufacturing process was invented and patented by Dawn White. In 1999, White founded Solidica Inc. to sell commercial UAM equipment—Form-ation machine suite. Near 2007, the Edison Welding Institute (EWI) and Solidica began a collaboration to re-design the weld tooling to remedy bond quality limitations and to expand the weldable metals of the process—so called very high power UAM. In 2011, Fabrisonic LLC was formed to commercialize the improved UAM process—SonicLayer machine suite.

Ultrasonic consolidation

The Ultrasonic Consolidation or Ultrasonic Additive Manufacturing process was invented and patented by Dawn White. In 1999, White founded Solidica Inc. to sell commercial UAM equipment—Form-ation machine suite. Near 2007, the Edison Welding Institute (EWI) and Solidica began a collaboration to re-design the weld tooling to remedy bond quality limitations and to expand the weldable metals of the process—so called very high power UAM. In 2011, Fabrisonic LLC was formed to commercialize the improved UAM process—SonicLayer machine suite.