Ultrasonic consolidation
The Ultrasonic Consolidation or Ultrasonic Additive Manufacturing process was invented and patented by Dawn White. In 1999, White founded Solidica Inc. to sell commercial UAM equipment—Form-ation machine suite. Near 2007, the Edison Welding Institute (EWI) and Solidica began a collaboration to re-design the weld tooling to remedy bond quality limitations and to expand the weldable metals of the process—so called very high power UAM. In 2011, Fabrisonic LLC was formed to commercialize the improved UAM process—SonicLayer machine suite.
Wikipage disambiguates
primaryTopic
Ultrasonic consolidation
The Ultrasonic Consolidation or Ultrasonic Additive Manufacturing process was invented and patented by Dawn White. In 1999, White founded Solidica Inc. to sell commercial UAM equipment—Form-ation machine suite. Near 2007, the Edison Welding Institute (EWI) and Solidica began a collaboration to re-design the weld tooling to remedy bond quality limitations and to expand the weldable metals of the process—so called very high power UAM. In 2011, Fabrisonic LLC was formed to commercialize the improved UAM process—SonicLayer machine suite.
has abstract
The Ultrasonic Consolidation o ...... cess—SonicLayer machine suite.
@en
Wikipage page ID
24,271,456
Wikipage revision ID
744,775,492
subject
hypernym
type
comment
The Ultrasonic Consolidation o ...... cess—SonicLayer machine suite.
@en
label
Ultrasonic consolidation
@en