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C6LC01319H
C6LC01319H
http://dx.doi.org/10.1039/C6LC01319H
A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications.
P356
Q48324863-D78C45A5-48B1-4B68-915B-BB839E668CEB
P356
C6LC01319H
http://dx.doi.org/10.1039/C6LC01319H