Materials and processing approaches for foundry-compatible transient electronics.
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Assembly and Self-Assembly of Nanomembrane Materials-From 2D to 3D.Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.Recent progress on biodegradable materials and transient electronics.Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics
P2860
Materials and processing approaches for foundry-compatible transient electronics.
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2017 թուականի Յունիսին հրատարակուած գիտական յօդուած
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2017 թվականի հունիսին հրատարակված գիտական հոդված
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2017年の論文
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2017年論文
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2017年論文
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2017年論文
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2017年論文
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2017年論文
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2017年论文
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Materials and processing approaches for foundry-compatible transient electronics.
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Materials and processing approaches for foundry-compatible transient electronics.
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type
label
Materials and processing approaches for foundry-compatible transient electronics.
@ast
Materials and processing approaches for foundry-compatible transient electronics.
@en
prefLabel
Materials and processing approaches for foundry-compatible transient electronics.
@ast
Materials and processing approaches for foundry-compatible transient electronics.
@en
P2093
P2860
P356
P1476
Materials and processing approaches for foundry-compatible transient electronics
@en
P2093
Christopher A Bower
Enming Song
Jan-Kai Chang
John A Rogers
P2860
P304
E5522-E5529
P356
10.1073/PNAS.1707849114
P407
P50
P577
2017-06-26T00:00:00Z