The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation.
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The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation.
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article científic
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article scientifique
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articolo scientifico
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artigo científico
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bilimsel makale
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scientific article published on 24 April 2014
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vedecký článok
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vetenskaplig artikel
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videnskabelig artikel
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vědecký článek
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name
The use of polyimide-modified ...... for electronic encapsulation.
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The use of polyimide-modified ...... for electronic encapsulation.
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type
label
The use of polyimide-modified ...... for electronic encapsulation.
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The use of polyimide-modified ...... for electronic encapsulation.
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prefLabel
The use of polyimide-modified ...... for electronic encapsulation.
@en
The use of polyimide-modified ...... for electronic encapsulation.
@nl
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The use of polyimide-modified ...... for electronic encapsulation.
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Chia-Yun Chen
Ching-Ping Wong
Kyoungsik Moon
Yagang Yao
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10.1038/SREP04779
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P50
P577
2014-04-24T00:00:00Z