Defects can increase the melting temperature of DNA-nanoparticle assemblies.
about
A model for Structure and Thermodynamics of ssDNA and dsDNA Near a Surface: a Coarse Grained ApproachFree energy considerations for nucleic acids with dangling ends near a surface: a coarse grained approach.Using theory and computation to model nanoscale properties.Multiscale mechanobiology: mechanics at the molecular, cellular, and tissue levels.Kinetics and thermodynamics of DNA hybridization on gold nanoparticlesPhase Transition and Optical Properties of DNA-Gold Nanoparticle AssembliesAn in vitro selection scheme for oligonucleotide probes to discriminate between closely related DNA sequences.DNA-functionalized polystyrene particles and their controlled self-assembly
P2860
Q34200979-D438E1E1-3521-4BA6-A14F-FC2CA9BF3EA3Q35316212-36AD0BC2-DF89-408A-92B8-7C3DBE0AD32EQ35758639-E810B963-18D4-4FBD-8234-14B66A98FB50Q36926393-A56F768A-1ED4-43D4-A187-AA3EF94E18C3Q37235367-BB35DA9A-44B2-479D-A9F5-0763A477C99BQ37562906-42248888-FEFE-4482-8C20-7217F70C9716Q38302836-343E74DB-8F45-4229-A1CF-A5A80015715AQ57271416-AEF9F61D-0E82-4BCC-912A-8B909C6A4235
P2860
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
description
2006 nî lūn-bûn
@nan
2006年の論文
@ja
2006年学术文章
@wuu
2006年学术文章
@zh
2006年学术文章
@zh-cn
2006年学术文章
@zh-hans
2006年学术文章
@zh-my
2006年学术文章
@zh-sg
2006年學術文章
@yue
2006年學術文章
@zh-hant
name
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@en
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@nl
type
label
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@en
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@nl
prefLabel
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@en
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@nl
P2860
P356
P1476
Defects can increase the melting temperature of DNA-nanoparticle assemblies.
@en
P2093
Ching-Hwa Kiang
Nolan C Harris
P2860
P304
16393-16396
P356
10.1021/JP062287D
P407
P577
2006-08-01T00:00:00Z