Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
about
Direct microfabrication of oxide patterns by local electrodeposition of precisely positioned electrolyte: the case of Cu2O.Intrinsically high-Q dynamic AFM imaging in liquid with a significantly extended needle tipFree-Space Nanometer Wiring via Nanotip ManipulationDielectric-dependent electron transfer behaviour of cobalt hexacyanides in a solid solution of sodium chlorideThree-dimensional printing of freeform helical microstructures: a review.Organic nanowire fabrication and device applications.Laser-assisted direct ink writing of planar and 3D metal architectures.Additive Manufacturing of Metal Structures at the Micrometer Scale.Guided Formation of 3D Helical Mesostructures by Mechanical Buckling: Analytical Modeling and Experimental Validation.Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology.Electrical stimulation towards melanoma therapy via liquid metal printed electronics on skin.Bioinspired Helical Microfibers from Microfluidics.Progression in the Fountain Pen Approach: From 2D Writing to 3D Free-Form Micro/Nanofabrication.Electrochemical micro/nano-machining: principles and practices.3D Printing of Conductive Complex Structures with In Situ Generation of Silver Nanoparticles.Electron-beam patterned self-assembled monolayers as templates for Cu electrodeposition and lift-off.Selectable Nanopattern Arrays for Nanolithographic Imprint and Etch-Mask Applications.Scanning droplet cell for chemoselective patterning through local electroactivation of protected quinone monolayers.Meniscus confined fabrication of multidimensional conducting polymer nanostructures with scanning electrochemical cell microscopy (SECCM).3D printing of free standing liquid metal microstructures.High-density gold nanowire arrays by lithographically patterned nanowire electrodeposition.Microscale 3D Printing of Nanotwinned Copper.Gigahertz Electromagnetic Structures via Direct Ink Writing for Radio-Frequency Oscillator and Transmitter Applications.Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition.High-Resolution Printing of 3D Structures Using an Electrohydrodynamic Inkjet with Multiple Functional Inks.Journal club
P2860
Q27344993-4147DEBD-B693-4421-A88C-69775B55DB91Q30453510-63EEFFD9-EEFB-4D82-969D-96AEB9A20BBDQ30662476-F705A7F7-F797-4DD1-84C4-B5DC741A3995Q33892110-C795D40D-A032-47D4-9E9E-39038DE0A7D7Q35215043-DD421839-0631-412E-8C60-480356FB67FDQ35303976-C4774312-9D6B-4665-9B37-FA02B13A4C6EQ36019539-23BEEFAF-CED5-41BF-9AD7-20A8B103CEABQ36239655-CE4361FF-5F82-4B6C-A745-5C0EBA94BA79Q37149191-09AA0F58-123A-4762-9411-46D9DDF82C78Q38640479-805B6CE6-738A-4FA3-8C38-4E2417E0892EQ38849007-FDD9EBED-A98D-4112-A8BB-10C31043DA17Q38925404-82C10378-A4B2-49E8-AC15-B3ADCFACC366Q39070447-15849E7A-3DD4-4276-ABF3-889D395971AAQ39123527-2E8A81AB-7F1A-40D4-804F-DA2EBB2C597DQ40360607-A504026E-B7D2-41B3-9FFD-EF7D7EE5C107Q41969560-07026F8F-C633-4269-BE18-953B134546A5Q42365965-DD5EB1B6-50CC-4CE7-A9C4-EB2729597BC6Q43418996-AE32CC75-8531-47F8-A0B5-4BB2111F79D9Q44056031-6E067F31-7739-493C-B17E-E915F71185EEQ44868691-2E15658C-0190-423A-B73C-51462CD1550DQ46057074-EE4F9D24-7543-44C0-8B85-B5935A17BF9DQ47273630-7831F94C-D4BB-46D6-936D-AD78ED699BE7Q51004097-92897270-D6E6-4110-8B50-CE3098DC684AQ51555700-6CD96FB6-A5CD-4965-B960-402C0FDB4ACCQ53647627-6AAA62AE-0FC4-4735-85D8-7CD0124448D8Q59034182-0CEE3675-8EE2-4493-BBC8-9F43355B898A
P2860
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
description
2010 nî lūn-bûn
@nan
2010年の論文
@ja
2010年学术文章
@wuu
2010年学术文章
@zh
2010年学术文章
@zh-cn
2010年学术文章
@zh-hans
2010年学术文章
@zh-my
2010年学术文章
@zh-sg
2010年學術文章
@yue
2010年學術文章
@zh-hant
name
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@en
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@nl
type
label
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@en
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@nl
prefLabel
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@en
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@nl
P2860
P356
P1433
P1476
Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.
@en
P2093
P2860
P304
P356
10.1126/SCIENCE.1190496
P407
P577
2010-07-01T00:00:00Z