UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
about
Experimental and numerical studies on standing surface acoustic wave microfluidics.Surface Acoustic Waves to Drive Plant TranspirationReusable acoustic tweezers for disposable devices.Surface acoustic wave microfluidics.Droplet trapping and fast acoustic release in a multi-height device with steady-state flow.On-chip droplet production regimes using surface acoustic waves.Highly focused high-frequency travelling surface acoustic waves (SAW) for rapid single-particle sorting.Microscale anechoic architecture: acoustic diffusers for ultra low power microparticle separation via traveling surface acoustic waves.Microfluidic resonant cavities enable acoustophoresis on a disposable superstrate.Simple, low cost MHz-order acoustomicrofluidics using aluminium foil electrodes.Particle separation using virtual deterministic lateral displacement (vDLD).Continuous flow actuation between external reservoirs in small-scale devices driven by surface acoustic waves.Frequency effects on the scale and behavior of acoustic streaming.Cost-effective rapid prototyping and assembly of poly(methyl methacrylate) microfluidic devices.Spatiotemporally controllable acoustothermal heating and its application to disposable thermochromic displays
P2860
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P2860
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
description
2012 nî lūn-bûn
@nan
2012年の論文
@ja
2012年学术文章
@wuu
2012年学术文章
@zh
2012年学术文章
@zh-cn
2012年学术文章
@zh-hans
2012年学术文章
@zh-my
2012年学术文章
@zh-sg
2012年學術文章
@yue
2012年學術文章
@zh-hant
name
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@en
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@nl
type
label
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@en
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@nl
prefLabel
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@en
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@nl
P2860
P356
P1433
P1476
UV epoxy bonding for enhanced SAW transmission and microscale acoustofluidic integration.
@en
P2093
Sean M Langelier
P2860
P304
P356
10.1039/C2LC40085E
P577
2012-06-14T00:00:00Z