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Localized thin film damage sourced and monitored via pump-probe modulated thermoreflectance.A magnetic resonance (MR) microscopy system using a microfluidically cryo-cooled planar coilHeat transfer and friction characteristics of the microfluidic heat sink with variously-shaped ribs for chip cooling.Applications of electrowetting-based digital microfluidics in clinical diagnostics.Recent advances in optical fiber devices for microfluidics integration.Investigation of different nanoparticles for magnetophoretically enabled nanofin heat sinks in microfluidics.Enhanced physicochemical properties of polydimethylsiloxane based microfluidic devices and thin films by incorporating synthetic micro-diamond.Optimal counter-current exchange networks.Microfluidic technique for measuring wax appearance temperature of reservoir fluids.A high-power ultrasonic microreactor and its application in gas-liquid mass transfer intensification.Analysis of geometry effects on band spreading of microchip electrophoresis.Chip cooling with integrated carbon nanotube microfin architecturesSingle-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense ElectronicsPerformance Analysis of a Microchannel Heat Sink with Various Rib ConfigurationsConjugate Heat Transfer Inside Microchannels Filled with Porous Media: An Exact SolutionNumerical Investigation of a Radial Microchannel Heat Exchanger with Varying Cross-Sectional ChannelsFlow and Heat Transfer in a Cross-Linked Silicon Microchannel Heat SinkMicrochannel Heat Sink with Designed Roughness: Analysis and OptimizationAnalytical Modeling of Fluid Flow and Heat Transfer in Microchannel/Nanochannel Heat SinksSuppressing high-frequency temperature oscillations in microchannels with surface structuresEnhanced Thermal Transport in Microchannel Using Oblique FinsThermal Management with Solid-Fluid Slip Irreversibility Treatment in Conjugate MicrodevicesCooling performance of a nanofluid flow in a heat sink microchannel with axial conduction effectEvolutionary Optimization of Electronic Circuitry Cooling Using NanofluidTwo-Dimensional Variable Property Conjugate Heat Transfer Simulation of Nanofluids in MicrochannelsA Review of Solar Photovoltaic ConcentratorsEffects of Nonuniform Incident Illumination on the Thermal Performance of a Concentrating Triple Junction Solar Cell
P2860
Q30252232-DFDE8319-12BB-42B8-8ACC-3E678B683640Q35091532-4DBB9875-2385-4C3A-A6EF-B10B756B85C9Q35605194-F2F5835C-EF37-4C5A-98A6-E04D5FAB9FA4Q37872299-A1C3590E-325E-4D55-9541-1AE0F1C78289Q38817742-E7F7993D-AE0A-4AA2-9981-B6F4C94694AEQ39227385-A71ABEEB-FCFA-4BE8-B94F-1A3C72C60ECDQ47103643-A12E627F-EF9E-4DE4-ACE7-0ACCDF03B923Q50534663-3EA530DD-1D95-4BDA-94DB-5020B43988F3Q51453252-E025B2D4-1A34-4B13-B4A5-8BCAA4F78EB9Q51502402-7DB31A4A-2908-4C2B-B455-2134FBAEC55AQ51602190-8511D922-AEFD-459B-824F-6F00EB450F3EQ54152437-8412659A-2DE1-411C-8689-140FC84DA2BCQ56431719-1A9CF678-5C95-47AA-B5F7-DC306FCEF753Q56909513-F5464300-AD5F-4D97-AAB0-A134EF370380Q56909542-F1A4C8D3-D4F8-4008-BC3F-D27F3276AA81Q56941885-6F4A692C-D9A1-4F61-AC99-DF34D26C28A3Q56941889-CDEF485F-6585-498D-9309-ED90C69AC8CAQ56941895-22C439F8-B327-4BCA-87AF-647901C15C61Q56941898-220E6D5B-F8DC-4D41-B0FD-616C199D1FB6Q57611709-0C67DEE3-2981-47E3-8E40-77C2F08A2247Q57712365-19029F2D-08F8-45D3-8E4E-FFFE0944F870Q58648843-709D1AC9-7D80-4B78-BBC0-6916D97953DEQ58753124-02410164-F32A-4A1D-B286-64A97D403893Q58913024-433D96CE-016A-4056-8831-73C6C8FFA29DQ59018998-51E9754C-45BE-43C7-AFE2-03A9CF42D254Q59045222-6FE8C8DE-CD48-4C2B-9B6A-48A352707AE8Q59045823-23BB961D-5A05-456C-BE51-3C34E1CD6671
P2860
description
wetenschappelijk artikel
@nl
наукова стаття, опублікована в травні 1981
@uk
name
High-performance heat sinking for VLSI
@en
High-performance heat sinking for VLSI
@nl
type
label
High-performance heat sinking for VLSI
@en
High-performance heat sinking for VLSI
@nl
prefLabel
High-performance heat sinking for VLSI
@en
High-performance heat sinking for VLSI
@nl
P356
P1476
High-performance heat sinking for VLSI
@en
P2093
D.B. Tuckerman
R.F.W. Pease
P304
P356
10.1109/EDL.1981.25367
P577
1981-05-01T00:00:00Z