IEEE Transactions on Components and Packaging Technologies
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Adhesion issues in flip-chip on organic modulesModeling of TE Cooling of Pump LasersAssessment of high-heat-flux thermal management schemesComputational parameter study of chip scale package array coolingVoid-effect modeling of flip-chip encapsulation on ceramic substrateElectrical and physical modeling of contact defects due to frettingEffect of Thermal Aging on the Microstructure Evolution and Solder Joint Reliability in Hard Disk Drive Under Mechanical ShockExtensive electrical and thermal characterization of an MCM-D technologyA time-domain method for the analysis of thermal impedance response preserving the convolution formImplications of Pb-free microelectronics assembly in aerospace applicationsClosed-Loop Controller for Eliminating the Contact Bounce in DC Core ContactorsA New Approach in Measuring Cu–EMC Adhesion Strength by AFMDense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface MaterialsComprehensive system-level optimization of thermoelectric devices for electronic cooling applicationsA voltage-controlled tunable thin-film distributed RC notch filterModeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chipA dual gate flash EEPROM cell with two-bit storage capacityPower Trace: An Efficient Method for Extracting the Power Dissipation Profile in an IC Chip From Its Temperature MapSwelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packagesGlass Frit as a Hermetic Joining Layer in Laser Based Joining of Miniature DevicesNanocomposite Thin Films for Surface Protection in Electrical Contact ApplicationsThermal modeling and management in ultrathin chip stack technologyResidual thermomechanical stresses in thinned-chip assembliesPhoto-Thermoelectric Technique for Anisotropic Thermal Diffusivity MeasurementsNanoscale heat transfer and nanostructured thermoelectricsCarbon Nanotube Applications in MicroelectronicsCorrection to "Micro scale pin fin heat sinks: Parametric performance evaluation study"TCPT-2006-096.R2: Micro Scale pin fin Heat Sinks —Parametric Performance Evaluation Study
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IEEE Transactions on Components and Packaging Technologies
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journal
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revista científica
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rivista scientifica
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vědecký časopis
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wetenschappelijk tijdschrift van Institute of Electrical and Electronics Engineers
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wissenschaftliche Zeitschrift
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مجلة
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name
IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A
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prefLabel
IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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IEEE Transactions on Components and Packaging Technologies
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