Solution Structure, Copper Binding and Backbone Dynamics of Recombinant Ber e 1–The Major Allergen from Brazil Nut
about
Do lipids influence the allergic sensitization process?Efficient production of (2)H, (13)C, (15)N-enriched industrial enzyme Rhizopus chinensis lipase with native disulfide bonds.Mo-CBP3, an antifungal chitin-binding protein from Moringa oleifera seeds, is a member of the 2S albumin family.Recombinant Allergen Production in E. coli.Structure of allergens and structure based epitope predictions.Purification and characterization of 2S albumin from Nelumbo nucifera.Two proteins for the price of one: Structural studies of the dual-destiny protein preproalbumin with sunflower trypsin inhibitor-1.Molecular Dynamics of Major Allergens from Alternaria, Birch Pollen and Peach.
P2860
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P2860
Solution Structure, Copper Binding and Backbone Dynamics of Recombinant Ber e 1–The Major Allergen from Brazil Nut
description
2012 nî lūn-bûn
@nan
2012 թուականին հրատարակուած գիտական յօդուած
@hyw
2012 թվականին հրատարակված գիտական հոդված
@hy
2012年の論文
@ja
2012年論文
@yue
2012年論文
@zh-hant
2012年論文
@zh-hk
2012年論文
@zh-mo
2012年論文
@zh-tw
2012年论文
@wuu
name
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@ast
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@en
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@nl
type
label
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@ast
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@en
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@nl
prefLabel
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@ast
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@en
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@nl
P2093
P2860
P3181
P1433
P1476
Solution Structure, Copper Bin ...... Major Allergen from Brazil Nut
@en
P2093
Erik Björn
Göran Larsson
Janusz Zdunek
Jürgen Schleucher
Louise Rundqvist
Marcos J C Alcocer
Tobias Tengel
P2860
P304
P3181
P356
10.1371/JOURNAL.PONE.0046435
P407
P577
2012-01-01T00:00:00Z