Printed circuit board manufacturing
Automated X-ray inspectionAutomated optical inspectionBead probe technologyBlind viaBoard-to-board connectorBoundary scanBoundary scan description languageBuried viaCapped viaCastellated holeCertified Interconnect DesignerChip on boardCircuitMakerComponent placementConformal coatingContact padCopper pourCorelisCoupon (PWB)DepanelingDesolderingEdge connectorElectroless nickel-phosphorus platingElectroless nickel immersion goldExpansion cardFR-2FR-4Filled viaG-10 (material)Hot air solder levelingIPC (electronics)Immersion silver platingIn-circuit testInsertion mount machineJTAGMicrostripMicroviaMonoboardNon functional padODB++
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Automated X-ray inspectionAutomated optical inspectionBead probe technologyBlind viaBoard-to-board connectorBoundary scanBoundary scan description languageBuried viaCapped viaCastellated holeCertified Interconnect DesignerChip on boardCircuitMakerComponent placementConformal coatingContact padCopper pourCorelisCoupon (PWB)DepanelingDesolderingEdge connectorElectroless nickel-phosphorus platingElectroless nickel immersion goldExpansion cardFR-2FR-4Filled viaG-10 (material)Hot air solder levelingIPC (electronics)Immersion silver platingIn-circuit testInsertion mount machineJTAGMicrostripMicroviaMonoboardNon functional padODB++
subject
broader
Printed circuit board manufacturing
Wikipage page ID
47,360,983
Wikipage revision ID
949,574,715
type
label
Printed circuit board manufacturing
@en
prefLabel
Printed circuit board manufacturing
@en