Dry etching
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.
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Dry etching
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.
has abstract
Dry etching refers to the remo ...... ectionally or anisotropically.
@en
La gravure sèche (dry etching) ...... des micro et nanotechnologies
@fr
Unter dem Begriff Trockenätzen ...... sikalische Effekte ausgenutzt.
@de
التنميش الجاف (dry etching) يق ...... نتوءات في المادة وتسمى مواد .
@ar
ドライエッチング(英語:dry etching)は、反応性の ...... の場合にできる生成物は四フッ化ケイ素 (SiF4) である。
@ja
건식 식각(乾式蝕刻, dry etching)은 분야에서 ...... 에는 플루오린화 수소 HF 와 XeF2이 주로 쓰인다.
@ko
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Dry etching refers to the remo ...... ectionally or anisotropically.
@en
La gravure sèche (dry etching) ...... des micro et nanotechnologies
@fr
Unter dem Begriff Trockenätzen ...... sikalische Effekte ausgenutzt.
@de
التنميش الجاف (dry etching) يق ...... نتوءات في المادة وتسمى مواد .
@ar
ドライエッチング(英語:dry etching)は、反応性の ...... の場合にできる生成物は四フッ化ケイ素 (SiF4) である。
@ja
건식 식각(乾式蝕刻, dry etching)은 분야에서 ...... 에는 플루오린화 수소 HF 와 XeF2이 주로 쓰인다.
@ko
label
Dry etching
@en
Gravure sèche
@fr
Trockenätzen
@de
تنميش جاف
@ar
ドライエッチング
@ja
건식 식각
@ko