Gold–aluminium intermetallic
A gold–aluminium intermetallic is an intermetallic compound of gold and aluminium that occurs at contacts between the two metals. These intermetallics have different properties than the individual metals, which can cause problems in wire bonding in microelectronics. The main compounds formed are Au5Al2 (white plague) and AuAl2 (purple plague), which both form at high temperatures.
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Ball bondingColored goldEutectic systemGold-aluminiumGold-aluminium intermetallicGold-aluminium intermetallicsGold-aluminum intermetallicsGold aluminideGold aluminiumGold aluminium intermetallicGold aluminium intermetallicsGold platingIntermetallicKirkendall effectPurple plaguePurple plague (intermetallic)Semiconductor packageTin pestWhisker (metallurgy)White plagueWhite plague (intermetallic)Wire bonding
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Gold–aluminium intermetallic
A gold–aluminium intermetallic is an intermetallic compound of gold and aluminium that occurs at contacts between the two metals. These intermetallics have different properties than the individual metals, which can cause problems in wire bonding in microelectronics. The main compounds formed are Au5Al2 (white plague) and AuAl2 (purple plague), which both form at high temperatures.
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A gold–aluminium intermetallic ...... ium or gold-to-gold junctions.
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Der Begriff Purpurpest bezeich ...... cher (engl. Kirkendall voids).
@de
金铝合金是金和铝形成的合金,是一类金属间化合物。这类化合物和 ...... 氧的存在下,AlI3进一步转化为Al2O3或Al(OH)3。
@zh
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A gold–aluminium intermetallic ...... oth form at high temperatures.
@en
Der Begriff Purpurpest bezeich ...... cher (engl. Kirkendall voids).
@de
金铝合金是金和铝形成的合金,是一类金属间化合物。这类化合物和 ...... 氧的存在下,AlI3进一步转化为Al2O3或Al(OH)3。
@zh
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Gold–aluminium intermetallic
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Purpurpest
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金铝合金
@zh