Wire bonding
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
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Wire bonding
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
has abstract
Bondování (anglicky: Wire Bond ...... – kombinace tepla a ultrazvuku
@cs
Dans le domaine des semi-condu ...... u fil est de l'ordre de 20 µm.
@fr
El soldado de cables es el mét ...... zona de contacto del destino.
@es
Il wire bonding è la tecnica p ...... utilizzato nel wedge bonding.
@it
Um fio de ligação (ou bond wir ...... psulamentos de semicondutores.
@pt
Wire bonding is the method of ...... at frequencies above 100 GHz.
@en
Wire bonding és un procés de i ...... it integrat a PCB o PCB a PCB.
@ca
Распайка выводов (англ. Wire b ...... зерная, ультразвуковая сварка.
@ru
ربط الأسلاك هي تقنية مستخدمة ف ...... لأسلاك عند توترات فوق 100 GHz.
@ar
ワイヤ・ボンディング(Wire Bonding)とは、直径十 ...... と集積回路の接続の大部分がワイヤボンディングで行われている。
@ja
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Bondování (anglicky: Wire Bond ...... í bez termických šumů. Metody:
@cs
Dans le domaine des semi-condu ...... u fil est de l'ordre de 20 µm.
@fr
El soldado de cables es el mét ...... ta los contactos de otro chip.
@es
Il wire bonding è la tecnica p ...... me. I diametri dei fili parton
@it
Um fio de ligação (ou bond wir ...... psulamentos de semicondutores.
@pt
Wire bonding is the method of ...... at frequencies above 100 GHz.
@en
Wire bonding és un procés de i ...... it integrat a PCB o PCB a PCB.
@ca
Распайка выводов (англ. Wire b ...... зерная, ультразвуковая сварка.
@ru
ربط الأسلاك هي تقنية مستخدمة ف ...... لأسلاك عند توترات فوق 100 GHz.
@ar
ワイヤ・ボンディング(Wire Bonding)とは、直径十 ...... と集積回路の接続の大部分がワイヤボンディングで行われている。
@ja
label
Bondování
@cs
Câblage par fil
@fr
Drahtbonden
@de
Fio de ligação
@pt
Soldado de cables
@es
Wire bonding
@ca
Wire bonding
@en
Wire bonding
@it
Распайка выводов
@ru
ربط الأسلاك
@ar