Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
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Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
description
im Juli 2016 veröffentlichter wissenschaftlicher Artikel
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wetenschappelijk artikel
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наукова стаття, опублікована в липні 2016
@uk
name
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@en
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@nl
type
label
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@en
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@nl
prefLabel
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@en
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@nl
P2860
P1476
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
@en
P2093
K. Jagannadham
P2860
P2888
P304
P356
10.1007/S11664-016-4793-X
P577
2016-07-28T00:00:00Z