about
A practical guide for the fabrication of microfluidic devices using glass and silicon.Measurements of true leak rates of MEMS packagesPrinciple of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene.Microfluidics: an enabling screening technology for enhanced oil recovery (EOR).Surface patterning strategies for microfluidic applications based on functionalized poly-p-xylylenes.Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon WafersCost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
P2860
Q36001822-09E59D9E-758B-485B-BFDA-9C8691D90492Q38021991-96FF458F-D6A0-4A65-862A-95D063C12678Q50222296-0BB7983B-B6B2-4B5C-938C-18544ED61835Q51464836-D9920A3A-205E-48F9-AC47-3A642FCEF312Q51553131-EF73D9DA-C238-4322-B3C8-57444E4332DEQ57429978-EDDC81F3-9BFF-413A-AB1A-0FC60E362117Q59284873-B76E2D6D-F55C-45C0-B13A-46307D674D23
P2860
description
im Februar 2006 veröffentlichter wissenschaftlicher Artikel
@de
wetenschappelijk artikel
@nl
наукова стаття, опублікована в лютому 2006
@uk
name
Adhesive wafer bonding
@en
Adhesive wafer bonding
@nl
type
label
Adhesive wafer bonding
@en
Adhesive wafer bonding
@nl
prefLabel
Adhesive wafer bonding
@en
Adhesive wafer bonding
@nl
P2093
P2860
P356
P1476
Adhesive wafer bonding
@en
P2093
F. Niklaus
R. J. Gutmann
P2860
P304
P356
10.1063/1.2168512
P577
2006-02-01T00:00:00Z