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S0021889813003695
S0021889813003695
http://dx.doi.org/10.1107/S0021889813003695
Crack propagation and fracture in silicon wafers under thermal stress
P356
Q30544547-07FDC960-5747-46BB-904F-9290981B479D
P356
S0021889813003695
http://dx.doi.org/10.1107/S0021889813003695