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TBCAS.2018.2797063
TBCAS.2018.2797063
http://dx.doi.org/10.1109/TBCAS.2018.2797063
Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.
P356
Q51416305-5E3A7D04-9AB3-495B-A923-0E9C8825C88E
P356
TBCAS.2018.2797063
http://dx.doi.org/10.1109/TBCAS.2018.2797063