Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.
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Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.
description
2018 nî lūn-bûn
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2018年の論文
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2018年学术文章
@wuu
2018年学术文章
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2018年学术文章
@zh-cn
2018年学术文章
@zh-hans
2018年学术文章
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2018年學術文章
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2018年學術文章
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name
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@en
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@nl
type
label
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@en
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@nl
prefLabel
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@en
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@nl
P2860
P1476
Epoxy Chip-in-Carrier Integrat ...... idic Lab-on-CMOS Microsystems.
@en
P2093
Andrew J Mason
P2860
P304
P356
10.1109/TBCAS.2018.2797063
P577
2018-04-01T00:00:00Z