Recent advances on electromigration in very-large-scale-integration of interconnects
about
Tomography experiment of an integrated circuit specimen using 3 MeV electrons in the transmission electron microscope.A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source.The electromigration effect revisited: non-uniform local tensile stress-driven diffusion.Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned CuAlternating-current induced thermal fatigue of gold interconnects with nanometer-scale thickness and width.Dynamic investigation of interface atom migration during heterostructure nanojoining.Characterization of micro-contact resistance between a gold nanocrystalline line and a tungsten electrode probe in interconnect fatigue testing.Tunable Ultra-high Aspect Ratio Nanorod Architectures grown on Porous Substrate via Electromigration.In situ synchrotron study of electromigration induced grain rotations in Sn solder jointsAb initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressingProbing nanocrystalline grain dynamics in nanodevices.In situ transmission electron microscopy imaging of electromigration in platinum nanowires.Phase-field modeling of two-dimensional crystal growth with anisotropic diffusion.Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation.Phase-Field-Crystal Model for Electromigration in Metal Interconnects.A microfluidic, dual-purpose sensor for in vitro detection of Enterobacteriaceae and biotinylated antibodies.Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: controllable nanotwin density and growth orientation with enhanced electrical endurance performance.Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder jointsElectromigration induced ductile-to-brittle transition in lead-free solder jointsLength-Dependent Electromigration Behavior of Sn58Bi Solder and Critical Length of ElectromigrationElectromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu jointsBuckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible SubstrateBuckling modes of polymer membranes restricted by metal wiresEffect of Premelting on Conductivity of DNA-Lipid FilmsMeasurements of current-voltage-induced heating in the Al/SrTiO3−xNy/Al memristor during electroformation and resistance switching
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P2860
Recent advances on electromigration in very-large-scale-integration of interconnects
description
im November 2003 veröffentlichter wissenschaftlicher Artikel
@de
wetenschappelijk artikel
@nl
наукова стаття, опублікована в листопаді 2003
@uk
name
Recent advances on electromigration in very-large-scale-integration of interconnects
@en
Recent advances on electromigration in very-large-scale-integration of interconnects
@nl
type
label
Recent advances on electromigration in very-large-scale-integration of interconnects
@en
Recent advances on electromigration in very-large-scale-integration of interconnects
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prefLabel
Recent advances on electromigration in very-large-scale-integration of interconnects
@en
Recent advances on electromigration in very-large-scale-integration of interconnects
@nl
P2860
P356
P1476
Recent advances on electromigration in very-large-scale-integration of interconnects
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P2093
P2860
P304
P356
10.1063/1.1611263
P577
2003-11-01T00:00:00Z