Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps.
about
Microfluidic Paper-Based Analytical Devices (μPADs) and Micro Total Analysis Systems (μTAS): Development, Applications and Future Trends.New family of fluorinated polymer chips for droplet and organic solvent microfluidics.Phase-changing sacrificial layer fabrication of multilayer polymer microfluidic devicesCharacterization of freestanding photoresist films for biological and MEMS applicationsLab-on-CMOS integration of microfluidics and electrochemical sensors.3D-Printed Microfluidics.Optimized piranha etching process for SU8-based MEMS and MOEMS construction.SU-8 free-standing microfluidic probes.Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technologyFabrication of 3D high aspect ratio PDMS microfluidic networks with a hybrid stamp.SU-8 based microprobes for simultaneous neural depth recording and drug delivery in the brain.SU8 diaphragm micropump with monolithically integrated cantilever check valves.Use of SU8 as a stable and biocompatible adhesion layer for gold bioelectrodes.Adhesive wafer bonding
P2860
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P2860
Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps.
description
2005 nî lūn-bûn
@nan
2005年の論文
@ja
2005年学术文章
@wuu
2005年学术文章
@zh
2005年学术文章
@zh-cn
2005年学术文章
@zh-hans
2005年学术文章
@zh-my
2005年学术文章
@zh-sg
2005年學術文章
@yue
2005年學術文章
@zh-hant
name
Fabrication of SU-8 multilayer ...... e bonding and releasing steps.
@en
Fabrication of SU-8 multilayer ...... e bonding and releasing steps.
@nl
type
label
Fabrication of SU-8 multilayer ...... e bonding and releasing steps.
@en
Fabrication of SU-8 multilayer ...... e bonding and releasing steps.
@nl
prefLabel
Fabrication of SU-8 multilayer ...... e bonding and releasing steps.
@en
Fabrication of SU-8 multilayer ...... e bonding and releasing steps.
@nl
P2093
P50
P356
P1433
P1476
Fabrication of SU-8 multilayer ...... ve bonding and releasing steps
@en
P2093
Ruano-López JM
P304
P356
10.1039/B500519A
P577
2005-04-11T00:00:00Z